Key Features
- High Thermal Conductivity (2.6 W/m·K)
Ensures efficient heat dissipation from electronic components. - Non-Curing Silicone System
Maintains stable thermal performance without hardening or cracking. - Excellent Electrical Insulation
Safe for electronic and electrical assemblies. - High Temperature Resistance
Performs reliably under continuous and intermittent high-temperature conditions. - Easy Application
Thick paste consistency allows smooth and uniform spreading. - Weather & Aging Resistant
Maintains performance in harsh operating environments.
Benefits
- Enhances heat dissipation efficiency
- Improves reliability and service life of electronic components
- Prevents overheating-related failures
- Maintains stable performance without drying or degradation
- Suitable for demanding industrial and electronic applications






