Fasto SP70 – Solar Grade Junction Box Potting Compound

Fasto SP70 is a two-part, PV-grade, neutral cure, silicone-based potting and encapsulating compound developed for long-term protection of electronic and solar components. Its low viscosity and self-leveling nature ensure complete filling of cavities, delivering superior sealing, insulation, and vibration resistance in demanding environments.

Packaging:

Part A: 12kg

Part B: 2kg

Key Features

Two-Part Neutral Cure System
Ensures controlled curing and excellent adhesion without corrosion.
Low Viscosity & Self-Leveling
Easily flows into complex cavities and fills voids uniformly.
Non-Corrosive & Electronics-Safe
Does not corrode circuits, contacts, or sensitive electronic components.
Excellent Environmental Resistance
Resistant to UV radiation, moisture, ozone, vibration, pollutants, and temperature extremes.
High Electrical Insulation Properties
Provides reliable dielectric strength and volume resistivity.
UL94 Tested & PV Grade
Suitable for solar and electronic encapsulation applications.

Benefits

Extends service life of solar junction boxes and electronics
Protects components from moisture ingress, dust, and vibration
Enhances thermal and electrical reliability
Prevents cracking, shrinkage, and mass loss over time
Ideal for renewable energy, electronics, and OEM applications

Primary Application	Sub-Applications	Functional Purpose	Key Performance Advantage
Junction Box Potting & Sealing	Solar panel JBs, electrical junction boxes, outdoor connection boxes	Complete filling & sealing of enclosures	Self-leveling, non-corrosive, UV & moisture resistant
PCB & Control Unit Encapsulation	PCBs, electronic control units, automation boards	Electrical insulation & mechanical protection	High dielectric strength, vibration damping
Relay & Driver Protection	Relays, LED drivers, switching modules	Prevent corrosion & electrical failure	Non-corrosive to contacts, stable insulation
Power Module Encapsulation	Power supplies, converters, control modules	Thermal & electrical protection	Supports thermal management, heat resistant
Vibration-Prone Electronics Potting	Mobile equipment electronics, machinery-mounted units	Absorbs mechanical stress & vibration	Flexible cured structure, high elongation
Outdoor Electronics Protection	Weather-exposed electronics, lighting electronics	Long-term environmental protection	UV, ozone & pollutant resistance
Electrical & Thermal Insulation	High-voltage components, insulated housings	Electrical safety & insulation	High volume resistivity, stable over time

Surface Preparation

Ensure surfaces are clean, dry, and free from dust, grease, oil, rust, and contaminants.
Clean surfaces using a suitable Fasto cleaner for best results.

Mixing Instructions

Mix Part A and Part B thoroughly in the recommended ratio:
- 4:1 (by volume)
- 6:1 (by weight)
Mix until a uniform, streak-free compound is obtained.

Application Method

Pour or dispense Fasto SP70 directly into the potting or encapsulation area.
Allow the material to self-level and fill the cavity completely.
Avoid air entrapment during mixing and pouring.
Remove excess material if required.

Curing Information

Pot life: approx. 12 minutes
Handling time: approx. 45 minutes
Full cure: 24 hours (at ambient conditions)

Joint & Encapsulation Guidelines

Suitable for potting junction boxes, drivers, relays, and electronic assemblies
For larger joints or sealing applications, use backer rod or bond breaker tape
Use masking tape for clean edges and remove it before skin formation

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