Key Features
- One-Part, Non-Curing Silicone Paste
Ensures long-term thermal performance without drying or cracking. - High Thermal Conductivity
Thermal conductivity of 1.1 W/m·K for efficient heat dissipation. - Excellent Electrical Insulation
High dielectric strength (>5.1 kV/mm) for electronics safety. - Wide Operating Temperature Range
- Continuous: -50°C to 200°C
- Intermittent: up to ~250°C
- Easy Application
Thick paste consistency allows smooth application using a spatula. - Good Weatherability & Stability
Maintains performance under harsh thermal and environmental conditions.
Benefits
- Improves heat dissipation efficiency
- Extends component and device lifespan
- Prevents overheating-related failures
- Ensures stable performance in high-temperature electronics
- Reduces thermal resistance caused by air gaps







