Fasto SP110 – LED Grade Silicone Transparent Potting Compound

Fasto SP110 is a two-part, high-performance, transparent, silicone-based potting compound designed for applications where flexibility, clarity, and component protection are critical. Its non-corrosive and low-hardness formulation makes it ideal for electronics and lighting assemblies, allowing easy rework or repair when required.

Fasto SP110 offers excellent electrical insulation, moisture resistance, and thermal stability, ensuring long-term protection of sensitive circuits and components.

Packaging:

Part – A : 12 kg

Part B: 1 kg (2 pieces)

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Key Features

  • Two-Part Transparent Silicone System
    Enables clear, aesthetic potting of electronic components.
  • Flexible & Low Hardness
    Allows removal of potting material for servicing or repairs.
  • Non-Corrosive & Electronics Safe
    Suitable for sensitive circuits and components.
  • Excellent Electrical Insulation
    Protects against short circuits and leakage.
  • Good Weather & Moisture Resistance
    Shields components from dust, humidity, and environmental exposure.
  • High Temperature Performance
    Reliable performance under continuous and intermittent heat.

Benefits

  • Provides clear visibility of potted components
  • Protects electronics from moisture, dust, and vibration
  • Reduces damage risk during thermal cycling
  • Enables easy maintenance and rework
  • Ideal for precision electronics and lighting assemblies
Primary Application Sub-Applications Functional Purpose Key Performance Advantage
LED Lighting Electronics Potting LED lights, LED modules, lighting control circuits Protect electronics from moisture & dust Flexible potting, good electrical insulation
Automotive Lighting Electronics Protection Automotive lamps, signal light circuits Environmental & vibration protection Flexible encapsulation, weather resistant
PCB & Circuit Protection PCBs, electronic circuits, control boards Electrical insulation & component safety Low hardness, removable for repair
Flexible Electronics Encapsulation Assemblies requiring soft potting Allows rework & repair of components Flexible, low hardness structure
Moisture & Dust Resistant Potting Electronics exposed to humidity & dust Environmental sealing Reliable moisture & dust protection
Electrical Appliance Electronics Potting Appliance control units, power circuits Improves safety & service life Stable electrical performance
Multi-Substrate Electronics Sealing Metal, glass & plastic housings Secure potting on mixed substrates Compatible with metals, glass & plastics

Surface Preparation

  • Ensure surfaces are clean, dry, and free from dust, oil, grease, rust, and contaminants.
  • Clean using a suitable Fasto cleaner if required.

Mixing Instructions

  • Mix Part A and Part B in a 10:1 ratio (by weight).
  • Stir thoroughly until a uniform, homogeneous mixture is obtained.

Application Method

  1. Pour Fasto SP110 evenly into the potting area.
  2. Apply the compound in the required quantity only.
  3. For deep potting or thick sections, vacuum deaeration is recommended to avoid air entrapment.
  4. Any tooling should be completed before skin-over time.
  5. Wipe off excess material if required.

Application Conditions

  • Application temperature: 5°C to 40°C
  • Optimum range: 15°C to 25°C

Curing Information

  • Skin-over time: 45–60 minutes
  • Full cure: 8–10 hours
    (Depends on temperature, humidity, and potting thickness)

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