Fasto SP210 - Silicone Sealants

Fasto SP210 – LED Grade Silicone Driver Potting

Fasto SP210 is a two-part, high-performance, silicone-based potting compound designed for applications where strong mechanical protection, electrical insulation, and thermal stability are required. Its non-corrosive, non-shrinking, and fast-curing formulation ensures reliable encapsulation of electronic components exposed to harsh environments.

Fasto SP210 delivers a unique balance of rigidity and flexibility, making it suitable for assemblies where potting must remain stable and durable over time while resisting vibration and thermal stress.

Packaging
Part A/B – 25kg

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Key Features

  • Two-Part Fast-Curing System
    Enables quick production cycles and reduced assembly time.
  • Non-Corrosive & Non-Shrinking
    Protects sensitive electronic components without volume loss.
  • Rigid yet Flexible Structure
    Provides strong mechanical support and vibration resistance.
  • Excellent Electrical Insulation
    High dielectric strength for circuit safety and reliability.
  • Good Thermal Conductivity
    Supports heat dissipation in electronic assemblies.
  • High Temperature & Weather Resistance
    Performs reliably under extreme operating conditions.

Benefits

  • Provides long-term protection against water, moisture, and dust
  • Enhances mechanical stability of electronic drivers and modules
  • Reduces failure risk due to thermal cycling and vibration
  • Ideal for sealed and permanent potting applications
  • Improves overall durability and service life of components
Primary Application Sub-Applications Functional Purpose Key Performance Advantage
LED Driver Potting & Encapsulation LED drivers, LED lighting control circuits, power modules Protect electronics from moisture, dust & vibration Fast curing, good electrical insulation, thermal conductivity
Lighting Electronics Protection Automotive lighting electronics, outdoor lighting circuits Long-term sealing & circuit protection Non-corrosive, weather resistant, stable at high temperatures
PCB & Circuit Protection Control boards, electronic circuits, power electronics Electrical insulation & mechanical protection High dielectric strength, non-shrinking
Rigid–Flexible Electronics Potting Assemblies requiring firm yet flexible encapsulation Secure components where removal is not required Balanced rigidity & flexibility, durable encapsulation
Moisture & Dust Resistant Encapsulation Electronics exposed to water, humidity & contaminants Environmental sealing of components Excellent moisture & dust resistance
Electrical Appliance Electronics Potting Home & industrial appliance control units, power circuits Safety & reliability enhancement Fast cure, good thermal & electrical performance
Multi-Substrate Sealing & Potting Metal, glass & plastic-based electronic housings Strong adhesion & sealing Compatible with metals, glass & engineering plastics

Surface Preparation

  • Ensure all surfaces are clean, dry, and free from dust, oil, grease, rust, and contaminants.
  • Clean substrates using a suitable Fasto cleaner if required.

Mixing Instructions

  • Mix Part A and Part B in a 1:1 ratio.
  • Stir thoroughly until a uniform, homogeneous colour is achieved.

Application Method

  1. Pour Fasto SP210 evenly into the potting cavity.
  2. Apply the compound in the required quantity only.
  3. For deep potting or thicker sections, vacuum deaeration is recommended to avoid air entrapment.
  4. Complete any tooling before skin-over time.
  5. Remove excess material if required.

Application Conditions

  • Application temperature: 5°C to 40°C
  • Optimum application range: 15°C to 25°C

Curing Information

  • Skin-over time: 10–20 minutes
  • Full cure: 3–4 hours
    (Depends on ambient temperature, mixed volume, and potting thickness)

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