Fasto E30B – Versatile Epoxy Adhesive for Bonding, Potting & Encapsulation

Fasto E30B is a very high-performance, two-part epoxy-based adhesive designed for multi-purpose industrial applications, including bonding, sealing, potting, and encapsulation. It is supplied in a ready-to-use, pre-measured cartridge system, ensuring error-free mixing and consistent results.

With its excellent mechanical strength, outstanding electrical properties, low shrinkage, and low exotherm, Fasto E30B is ideal for small to medium mechanical, electrical, and electronic components requiring long-term durability and reliability.

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Key Features

  • Two-Part Epoxy System (Clear Finish)
    Suitable for visible bonding and encapsulation.
  • Very High Mechanical Strength
    • Compressive strength: 95 N/mm²
    • Tensile strength: 58 N/mm²
  • Excellent Electrical Properties
    Suitable for electrical and electronic assemblies.
  • Low Shrinkage & Low Exotherm
    Minimizes internal stress on sensitive components.
  • Good Chemical & Water Resistance
    Resistant to oils, fuels, brake fluid, propanol, and water.
  • Controlled Working Time
    20–30 minutes, allowing accurate alignment and positioning.
  • High Temperature Resistance
    Suitable for continuous use up to 125°C.

Benefits

  • Provides strong, durable structural bonds
  • Ideal for electronics, jewellery, and precision assemblies
  • Ensures reliable potting and encapsulation
  • Reduces component stress and failure risk
  • Delivers consistent performance in demanding environments
Primary Application Sub-Applications Functional Purpose Key Performance Advantage
Structural Bonding of Metal Components Steel, aluminium, brass assemblies High-strength structural bonding Very high tensile & compressive strength
Machine Assembly & Manufacturing Small, medium & large machine assemblies Secure bonding & holding of components Long working time enables precise assembly
Ceramic & Glass Component Bonding Ceramic parts, glass components Rigid, durable bonding Excellent adhesion on rigid substrates
Multi-Substrate Bonding Metal, ceramic, concrete, wood, rubber combinations Bond dissimilar materials Broad substrate compatibility
Industrial Repair & Maintenance Repair of worn or broken parts Restore component integrity High gap-filling ability (up to 0.5 mm)
Medical & Precision Machinery Assembly Medical devices, precision equipment Reliable, high-strength joints Strong fixing with dimensional stability
Chemical-Resistant Bonding Applications Assemblies exposed to oils & solvents Long-term durability Excellent chemical & solvent resistance
Load-Bearing Industrial Joints Structural joints under static load Maintain joint integrity Retains strength at elevated temperatures

Surface Preparation

  • Ensure surfaces are clean, dry, and free from oil, grease, dust, and contaminants.
  • Trials are recommended to determine if additional cleaning is required.

Mixing Instructions

Supplied as Resin (Part A) and Hardener (Part B) in the correct ratio.

Mixing ratio: 2 : 1

  1. Stir Part A (resin) thoroughly, as fillers may settle during storage.
  2. Add the measured quantity of Part B (hardener) to the resin.
  3. Mix by hand using a spatula or with a slow-speed mixer for 2–3 minutes until a uniform white colour is obtained.
  4. Incomplete mixing may result in poor curing, reduced strength, or soft spots.

Application Method

  • Apply the mixed adhesive by pouring or brushing onto the desired area.
  • Assemble components within the working time (20–30 minutes).
  • Allow curing until the required handling or final strength is achieved.

Curing Guidelines

  • Working time: 20–30 minutes
  • Full cure: 24 hours
  • Cure speed depends on temperature, substrate, and mixed mass.
  • Heating the assembly accelerates curing; smaller mix volumes cure more slowly.

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