Fasto SP110 - Silicone Sealants
Features of SP110
Fasto SP110 - Silicone Sealants
Features of SP110

Fasto SP110 – LED Grade Transparent Potting Compound

Fasto SP110 is a two-part, high-performance, transparent, silicone-based potting compound designed for applications where flexibility, clarity, and component protection are critical. Its non-corrosive and low-hardness formulation makes it ideal for electronics and lighting assemblies, allowing easy rework or repair when required.

Fasto SP110 offers excellent electrical insulation, moisture resistance, and thermal stability, ensuring long-term protection of sensitive circuits and components.

Packaging:

Part A: 10kg

Part B: 1kg

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Key Features

  • Two-Part Transparent Silicone System
    Enables clear, aesthetic potting of electronic components.
  • Flexible & Low Hardness
    Allows removal of potting material for servicing or repairs.
  • Non-Corrosive & Electronics Safe
    Suitable for sensitive circuits and components.
  • Excellent Electrical Insulation
    Protects against short circuits and leakage.
  • Good Weather & Moisture Resistance
    Shields components from dust, humidity, and environmental exposure.
  • High Temperature Performance
    Reliable performance under continuous and intermittent heat.

Benefits

  • Provides clear visibility of potted components
  • Protects electronics from moisture, dust, and vibration
  • Reduces damage risk during thermal cycling
  • Enables easy maintenance and rework
  • Ideal for precision electronics and lighting assemblies
Primary ApplicationSub-ApplicationsFunctional PurposeKey Performance Advantage
LED Lighting Electronics PottingLED lights, LED modules, lighting control circuitsProtect electronics from moisture & dustFlexible potting, good electrical insulation
Automotive Lighting Electronics ProtectionAutomotive lamps, signal light circuitsEnvironmental & vibration protectionFlexible encapsulation, weather resistant
PCB & Circuit ProtectionPCBs, electronic circuits, control boardsElectrical insulation & component safetyLow hardness, removable for repair
Flexible Electronics EncapsulationAssemblies requiring soft pottingAllows rework & repair of componentsFlexible, low hardness structure
Moisture & Dust Resistant PottingElectronics exposed to humidity & dustEnvironmental sealingReliable moisture & dust protection
Electrical Appliance Electronics PottingAppliance control units, power circuitsImproves safety & service lifeStable electrical performance
Multi-Substrate Electronics SealingMetal, glass & plastic housingsSecure potting on mixed substratesCompatible with metals, glass & plastics

Surface Preparation

  • Ensure surfaces are clean, dry, and free from dust, oil, grease, rust, and contaminants.
  • Clean using a suitable Fasto cleaner if required.

Mixing Instructions

  • Mix Part A and Part B in a 10:1 ratio (by weight).
  • Stir thoroughly until a uniform, homogeneous mixture is obtained.

Application Method

  1. Pour Fasto SP110 evenly into the potting area.
  2. Apply the compound in the required quantity only.
  3. For deep potting or thick sections, vacuum deaeration is recommended to avoid air entrapment.
  4. Any tooling should be completed before skin-over time.
  5. Wipe off excess material if required.

Application Conditions

  • Application temperature: 5°C to 40°C
  • Optimum range: 15°C to 25°C

Curing Information

  • Skin-over time: 45–60 minutes
  • Full cure: 8–10 hours
    (Depends on temperature, humidity, and potting thickness)

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