TG100 - Thermal Grease Silicone Paste

Fasto TG100 – High-Performance Thermally Conductive Silicone Grease

Fasto TG100 is a one-part, non-curing, high-performance silicone-based thermal grease designed to ensure efficient heat transfer between heat-generating components and heat-dissipating surfaces. It is specially formulated to fill microscopic air gaps, reducing thermal resistance and improving heat dissipation in electronic, electrical, and LED assemblies.

With excellent thermal conductivity, strong electrical insulation properties, and outstanding performance at elevated temperatures, Fasto TG100 ensures reliable thermal management and long-term stability under continuous and intermittent high-temperature operating conditions.

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Key Features

  • One-Part, Non-Curing Silicone Paste
    Ensures long-term thermal performance without drying or cracking.
  • High Thermal Conductivity
    Thermal conductivity of 1.1 W/m·K for efficient heat dissipation.
  • Excellent Electrical Insulation
    High dielectric strength (>5.1 kV/mm) for electronics safety.
  • Wide Operating Temperature Range
    • Continuous: -50°C to 200°C
    • Intermittent: up to ~250°C
  • Easy Application
    Thick paste consistency allows smooth application using a spatula.
  • Good Weatherability & Stability
    Maintains performance under harsh thermal and environmental conditions.

Benefits

  • Improves heat dissipation efficiency
  • Extends component and device lifespan
  • Prevents overheating-related failures
  • Ensures stable performance in high-temperature electronics
  • Reduces thermal resistance caused by air gaps

Application details are available on request. Please contact our technical team.

Surface Preparation

  • Ensure contact surfaces are clean, dry, and free from rust, scale, dust, grease, oil, release agents, or any other contaminants.
  • Clean surfaces using a suitable Fasto cleaner for optimal thermal contact and performance.

Application Method

  • Apply Fasto TG100 evenly using a spatula or suitable applicator.
  • Spread the paste uniformly to eliminate trapped air between the heat-emitting surface and the heat-radiating surface.
  • Apply sufficient quantity to ensure complete surface contact, then wipe off excess material.
  • Avoid excessive application, as it may reduce thermal efficiency.

Application Conditions

  • Application temperature range: 5°C to 40°C
  • Optimum application temperature: 15°C to 25°C

Curing Information

  • Non-curing product
  • Remains as a stable, flexible paste throughout service life
  • No skin formation or hardening over time

Joint & Thermal Interface Guidelines

  • Designed for thermal interface applications, not structural bonding
  • Suitable for filling air gaps between uneven contact surfaces
  • Ideal for continuous heat transfer at elevated temperatures
  • Not recommended for use in pure oxygen or oxygen-rich environments
  • Should not be used as a sealant against chlorine or strong oxidizing materials

To access Technical & Safety Documents, please submit your details.








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